data brief for further information contact your local stmicroelectronics sales office. june 2007 rev 1 1/7 7 STA260 sirius sdars channel, service & source decoder features 2 satellite and 1 terrestr ial signal demodulators and decoders advanced dsp processor to implement pac audio decoder requires a single 17mhz clock reference; all high-speed clock signals are derived using on-chip pll programmable i 2 s to support 32k/48k/44.1k audio sample rate (32k/48k sample rates use internal clocks, 44.1k sample rate uses external clock) i 2 c master interface to control tuner and audio dac external control through uart interface using sirius standard protoc ol (ssp) over rs-232 analog to digital converters three internal 10 bit a/d converters for 76.5mhz if signals conversion low power technology 1.2v, 90 m technology 2.5v capable i/os description STA260 is a fully integrated 3rd generation baseband signal processor for sirius satellite digital audio radio service (sdars). it is implemented using st micro's advanced 90 m cmos090 technology. it allows a highly efficient implementation of a sirius ?sdars satellite digital audio radio service? receiver when used with its companion sta210 tuner asic. STA260 is packaged in a low profile fine pitch ball grid array (lfbga 15x15) and in very thin fine pitch ball grid array (vfbga 8x8). lfbga289 vfbga244 (15x15x1.4mm) (8x8x1.0mm) table 1. device summary part number (1) 1. this device is pb-free ecopack? see chapter 3: package information . package packing STA260 lfbga289 tray STA260tr lfbga289 tape & reel STA260-8x8 vfbga244 tray www.st.com
application block diagram STA260 2/7 1 application block diagram figure 1. application block diagram ac00244 if STA260 baseband processor STA260 baseband processor audio/i 2 s flash 1m x 16 ifagc sta210n tuner fe i2c sdram 8mbx8 or 16mx8 data
STA260 electrical specifications 3/7 2 electrical specifications 2.1 absolute maximum ratings 2.2 thermal data table 2. absolute maximum ratings symbol parameter value unit v dd 1.2v power supply voltage 1.32 v v ddio 2.5v power supply voltage 2.75 v a d_vdd 1.2v power supply voltage 1.32 v a d_vdd2 2.5v power supply voltage 2.75 v a pll_vdd 2.5v power supply voltage 2.75 v v i voltage on input pin -0.5 to (v ddio + 0.5) v v o voltage on output pin -0.5 to (v ddio + 0.5) v t stg storage temperature -55 to +150 c t op operative ambient temperature -40 to +85 c t j operative junction temperature -40 to +125 c table 3. thermal data symbol parameter lfbga vfbga unit r th j-amb thermal resistance junction to ambient (1) 1. according to jedec specif ication on a 4 layers board 35 50 c/w
package information STA260 4/7 3 package information in order to meet environmental requirements, st offers these devices in ecopack? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com. figure 2. lfbga (15x15x1.4mm 289 ball) mechanical data & package dimensions outline and mechanical data dim. mm inch min. typ. max. min. typ. max. a 1.400 0.0551 a1 0.210 0.0083 a2 0.985 0.0387 a3 0.200 0.0078 a4 0.800 0.0315 b 0.350 0.400 0.450 0.0138 0.0157 0.0177 d 14.850 15.000 15.150 0.5846 0.5906 0.5965 d1 12.800 0.5039 e 14.850 15.000 15.150 0.5846 0.5906 0.5965 e1 12.800 0.5039 e 0.800 0.0315 f 1.100 0.0433 ddd 0.120 0.0047 eee 0.150 0.0059 fff 0.080 0.0031 lfbga289 l ow profile f ine pitch b all g rid a rray body: 15 x 15 x 1.4mm 7963045 c
STA260 package information 5/7 figure 3. vfbga (8x8x1.0mm 180+64 ball) mechanical data & package dimensions outline and mechanical data dim. mm inch min. typ. max. min. typ. max. a 1.000 0.0394 a1 0.130 0.170 0.210 0.0051 0.0067 0.0083 a2 0.620 0.0244 a3 0.180 0.0071 a4 0.450 0.0177 b 0.220 0.260 0.300 0.0087 0.0102 0.0118 d 7.950 8.000 8.050 0.3130 0.3150 0.3169 d1 6.800 0.2677 e 7.950 8.000 8.050 0.3130 0.3150 0.3169 e1 6.800 0.2677 e 0.400 0.0157 f 0.600 0.0236 ddd 0.080 0.0031 eee 0.130 0.0051 fff 0.040 0.0016 vfbga244 v ery thin profile f ine pitch b all g rid a rray body: 8 x 8 x 1.0mm 7520777 c
revision history STA260 6/7 4 revision history table 4. document revision history date revision changes 18-jun-2007 1 initial release.
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